MediaTek’s Dimensity 1000C is quite a powerful chipset. In fact, a new report has shown that the chip marginally outperforms rivals such as Qualcomm’s Snapdragon 765G and HiSilicon’s Kirin 820 chips.
The leak was shared on popular Chinese social media platform Weibo. The poster uploaded screenshots of the processor’s performance scores through benchmarks.
As seen on the benchmark scores, the Dimensity 1000C scored 601 points on Geekbench 5’s single-core test and 2,365 on the multi-core test. In comparison, the snapdragon 765G scores 607 in the single-core test but only manages 1,777 in the multi-core test.
The Dimensity 1000C is built on a 7nm process and features four ARM Cortex-A77 cores plus 4 ARM Cortex-A55 cores along with the Mali-G57 GPU. It uses a MediaTek AI Processing Unit (APU 3.0) that runs the smartphone’s AI cameras, voice assistant, and other applications.
The Dimensity 1000C is a mid-range chip, closer in performance to the Dimensity 800 series than to the flagship Dimensity 1000. It is interesting that it beats the Snapdragon 765 and rivals the Kirin 820.