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Qualcomm Snapdragon 875 Specifications leak; it features a 5nm Process and the Adreno 660 GPU

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Qualcomm Snapdragon chip

The war among mobile chipsets appears to be getting fiercer by the day. Details of the specifications of the Qualcomm Snapdragon 875 processor have just leaked, and the specs are pretty interesting.

Qualcomm is a leading manufacturer when it comes to mobile chipsets. In fact, its current flagship, the Snapdragon 865, can be seen in many flagship devices today. The same can be said of the company’s older flagships too. Qualcomm is expected to release the upcoming Snapdragon 875 chipset later this year. This will be the successor to the already-successful Snapdragon 865 chip. One of the major highlights of the Snapdragon 875 is that it will be built on a 5nm process.

The Qualcomm Snapdragon 875 chipset has now appeared in a new leak, and we have seen some of its specifications. The chip has the code name “SM8350”. It will come with the X60 5G modem-RF system. However, the leak did not reveal if Qualcomm will integrate the 5G modem or make it optional. If the current market trends are anything to go by though, Qualcomm will likely integrate it.

We expect the Qualcomm Snapdragon 875 chip to feature some upgrade in performance, but we do not yet know by how much it will perform better than the Snapdragon 865.

Read Also: MediaTek officially unveils the Helio G85 Chipset

Qualcomm Snapdragon 875 Specifications

The leaked specifications of the Qualcomm Snapdragon 875 chipset have revealed a lot about the chip. In the CPU department, the chip will come with a Kryo 685 CPU built on Arm v8 Cortex technology. It will use an Adreno 660 GPU, Adreno 665 VPU, and Adreno 1095 DPU.

The Qualcomm Snapdragon 875 chip will use Qualcomm Secure Processing Unit (SPU250), Spectra 580 image-processing engine, and Snapdragon Sensors Core Technology. According to the leak, the chip will also come with Compute Hexagon DSP with Hexagon Vector eXtensions and Hexagon Tensor Accelerator. It will support Quad-channel Package-on-Package (PoP) high-speed LPDDR5 SDRAM and a low-power audio subsystem combined with Aqstic Audio Technologies WCD9380 and WCD9385 audio codec.

Read Also: Samsung’s Exynos 1000 Chipset performs 3 times better than Snapdragon 865 in Benchmark Test

In the connectivity department, the Qualcomm Snapdragon 875 supports 3G/ 4G/ 5G modem – millimeter wave (mmWave) as well as sub-6GHz bands. It also supports external 802.11ax, 2×2 MIMO, and Bluetooth Milan.

If older release time tables are followed, Qualcomm will likely release the Snapdragon 875 at its year-end conference in December. However, we cannot say for sure right now, considering the effects of the current coronavirus pandemic around the world.

Meanwhile, just yesterday, we reported the MediaTek just unveiled the Helio G85 chipset. The chip has already made an appearance in the Redmi Note 9 device. There have also been serious talks about the upcoming MediaTek Dimensity 1000 chipset. Samsung is also working on the Exynos 1000 SoC, a chip that recently performed 3 times better than the Snapdragon 865 in a benchmark test.

Author: Vincent Abolarin

Vincent is an Electrical Engineer and smartphone enthusiast. Anything about smartphones, count him in!

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